RoHS stands for "Reduction of Hazardous Substances" and is a European Union directive. The EU wants to limit hazardous materials from entering the environment. The EU started in 2003 with WEEE (Waste Electrical and Electronic Equipment) that aimed to recycle equipment and keep it from landfills, and the RoHS legislation took it a step further by reducing the harmful materials from all electronics entering the EU.
The directive was enacted in the EU on July 1, 2006. This means that all new products shipped to arrive after July 1 2006 must be RoHS compliant.
You can find the official Array Networks Environmental Policy on RoHS and WEEE Directives documents via the links at the top of this page.
Yes, the RoHS Directive applies strictly to countries that are members of the European Union. Every EU state and the United Kingdom have the same rules regarding RoHS.
Yes, both the APV and SPX products are RoHS compliant.
The restricted substances and maximum levels are:
1. Lead (Pb) 0.1% (1000 PPM)
2. Mercury (Hg) 0.1% (1000 PPM)
3. Cadmium (Cd) 0.01% (100 PPM)
4. Hexavalent chromium (Cr+6) 0.1% (1000 PPM)
5. PPB 0.1% (1000 PPM)
6. PBDE 0.1% (1000 PPM)
Lead-free is interpreted as having no lead substance. RoHS compliant parts may have lead in amounts not to exceed 0.1% wt of homogeneous substance. In addition, there are several exemptions that are applicable to our equipment.
The RoHS directive allows networking manufacturers to claim specific exemptions. Array claims the following exemptions:
1.Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications
2. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
3. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
4.Lead in solder consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
5.Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight (i.e. screws)
6. Lead used in compliant pin connector systems (i.e. connectors)
7. Lead and cadmium in optical and filter glass
8. Lead in electronic ceramic parts (e.g. piezoelectronic devices)
Yes. Please refer to this document “043121766 ArrayNet report v1” (link at top of page), supplied by our consulting services firm ERA technology in the United Kingdom.
Non-RoHS units will be RMA'd with other non-RoHS units until non-RoHS inventories are depleted.